The title picture

The picture

The chip in the picture is the MIMO OFDM chip from the year 2005 manufactured by UMC 250nm technology.

There is no special reason why we chose this chip, it just happened to be lying around when we tried to take the picture. It is also fairly large and looked good in the picture.

The wafer below is an Austriamicrosystems 600nm wafer from the year 2002. This wafer contains the chips:

• DCO
• JAC
• LIN
• PIC16c5x
• RG2001
• Riddler
• Serpent
• Transceiver
• biomed
• fft

The picture is slightly manipulated with GIMP to correct a bent pin that was disturbing.