|Dimensions||3432.09μm x 3131.97μm|
|Power||10W (@1MHz, 1.2V) mW|
This ASIC contains the digital baseband for the 3G standard TD-SCDMA / TD-HSPA, which is emerging from China. It supports the modulation schemes (QPSK, 8PSK, 16QAM, 64QAM) and channel coding schemes of all legacy and enhanced modes of the TD-HSPA+ LCR single-carrier downlink. The ASIC receives I/Q samples and provides the decoded transport block bits.
The chip contains abot 560 kGE of logic in addition to about 640 kBits of SRAM.
This chip is a redesign of an earlier version, hence the name B1.