The IIS Chip Gallery

Vivosoc2.001 (2016)

Additional pictures below, click to see larger versions



by

Giovanni Rovere, Florian Glaser, Xu Han, Schekeb Fateh, Philipp Schoenle, Thomas Burger

Main Details

Application	Biomedical
Technology	130
Manufacturer	SMIC
Type	Research
Package	BGA169
Dimensions	4368μm x 4768μm
Gates	800 kGE
Voltage	1.2 V-0.6V
Power	20 mW (@50MHz, 1.2V)
Clock	64 MHz

Description

The VivoSoC 2.001 is an incremental tape-out of VivoSoC platform for biomedical signal acquisition. This chip is feature rich and designed to be potentially employed in different portable applications, e.g.: mass-market consumer fitness tracker, medical-grade teleheath point-of-care, implantable devices for chronic disease monitoring and management.

To fit the tight energy budgets of portable devices, the operating point of each SoC block can be fine tuned to trade-off unnecessary precision with power.

Main chip features:

• Quad-core RISC processor of the PULP family equipped with SPIs, UART, GPIOs, JTAG and I2C digital interfaces and a L2 memory of 128kB.
• PULP cluster and peripherals embedded in two independent voltage and clock domain regions to allow voltage and frequency scaling.
• 9-channels 12kHz-66dB analog-front-end for time-multiplexed ExG recording (with lead-off detection).
• 4-channels Transimpedance Medical Amplifier and LEDs driver for photoplethysmogram (PPG).
• 2-channels Bio-Impedance analog-front-end.
• 3 fully flexible SAR-ADC for digitizing biomedical signals (ExG, PPG, bio-impedance).
• 6-channels nerve blocking and stimulation circuit.
• General purpose algorithmic ADC for auxiliary sensor recordings.
• On-chip LDOs to provide a clean supply for the analog circuits.
• On-chip clock-generator and biasing.

The name VivoSoC is based on the Italian word "Vivo" that can be translated as "Alive". The logo continues the trend of Stanley Kubrick's 2001: A Space Odyssey inspired logos on chips where Philipp Schoenle has worked on. The chip was manufactured on an MPW run with several smaller dies. As a result we had only very few intact VivoSoC2.001 dies available and all of them were packaged. The photos show a die that was diced through so that other dies can be taken out.

Related Publication

• Philipp Schoenle, Florian Glaser, Thomas Burger, Giovanni Rovere, Luca Benini, Qiuting Huang, "A Multi-Sensor and Parallel Processing SoC for Miniaturized Medical Instrumentation", IEEE Journal of Solid-State Circuits PP issue:99, pp 1-12, DOI: 10.1109/JSSC.2018.2815653