The IIS Chip Gallery
Occamy (2022)
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by
| Application | Pulp |
| Technology | 12 |
| Manufacturer | GF |
| Type | Research |
| Package | Custom |
| Dimensions | 10500μm x 6950μm |
| Gates | 300 MGE |
| Voltage | 1.2 V |
| Power | 10 W @1GHz |
| Clock | 1 GHz |
Occamy is the compute die of an ambitious project that has been very generously sponsored by Globalfoundries and Rambus as well as support from Synopsys and Micron.
The compute die contains 216 RISC-V cores and includes an HBM controller by Rambus. Two such dies will be connected on an interposer and each compute die will have access to its own HBM memory that is also assembled together on the same module. More to come.